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DomainsData.org: CWI Technical Sales

  • Title:
    CWI Technical Sales
  • Age:
    17 years old
  • Alexa Rank:
    10,228,651
  • Total Sites Linking In (Alexa):
    9
  • Domain's IP Country:
  • Status Code:
    OK
  • IP Address:
    173.201.239.128
  • Description:
    CWI Technical Sales is a manufacturers' representative organization offering products & solutions to the semiconductor, optoelectronic, wireless, defense/aerospace, life sciences and other related industries. Located in Central New Jersey, the company has been representing tier-one equipment suppliers on the east coast for over 30 years. These companies offer products in the test & measurement, wafer processing, inspection/metrology, backend operations and failure analysis areas. CWI has maintained very strong relationships with its customers and is committed to delivering top quality solutions to them. We are a hands-on organization, making sure we know the products intimately. Our sales staff prides itself with understanding how the products operate and apply to our customers' applications. CWI Technical Sales also employs a technical service support staff highly knowledgeable in hardware, software and automation, reinforcing our commitment to each customer's success.
  • Keywords:
    Semiconductor Manufacturers Reps, New Jersey, East Coast Semiconductor Manufacturers Representatives, Molecular imprint, imprint lithography, lithography, litho, photolithography, UV lithography, UV, UV nanoimprint, nano imprint, nanoimprint, flash lithography, Nano lithography, optical lithography, semiconductor, step and flash, step and repeat, S-FIL, Imprio, advanced lithography, nanolithography, next generation lithography, Nanotechnology, Nano technology, Nano, sub nano, MonoMat, microfluidics, surface treatment, etchers, CVD, ion implant, CLP, back side alignment, radiometers, Power meters, UV measurement, Solar simulator, solar simulation, ozone surface treatment, probes, aligner, bonder, wafer bonder, mask aligner, bond, MEMS, bulk MEMS, semiconductor, photolithography, Fodel, thick resist, thin resist, anodic bonding, substrate bonding, micromachining, SOI, biomedical, microfluidics, UV light sources, UV exposure, optoelectronics, wafer bumping, wafer level packaging, alignment, interconnect, darkfield alignment, compound semiconductors, III-V materials, cleanroom automation, conveyors, resistivity meter, metrology tool, laser meter, production aligner, manual aligner, pilot production, engineering tool, Modular Process Technology, RTP, Semiconductor, Rapid Thermal Processing, Allwin21, AG Associates, RTP-610, RTP-810, Heatpulse, AccuThermo, equipment, tools, manufacturer, 300mm, 200mm, front end process, processing anneal, annealing, annealer, RTA, RTO, MPT, semi-conductor industry, furnace, oven replacement, RTP600, RTP800, RTP3000, Modular One, aoi, AOI, pcb, wafer inspection, automated optical inspection, Camtek, Artwork inspection, Assembly, Automatic Final Inspection, Automatic Material Handling, Automatic Optical Inspection, Barco, BGA, PCB, MEP, RF, falcon, CAMT, Camtec, wafer inspection, Camtek, Circuits, Copper, Defect, Design rule check, HDI, Microelectronics, High Density Interconnect, defects, falcon, microscope, microscopy, nanoscale optical profilers, optical profilers, advanced confocal microscopy, confocal microscopy, confocal, nanotechnology, hybrid metrology, 3D measurements, 3D imaging, 3d, three dimensional, measurement, imaging, interferometer, interferometry, spectroscopy, light microscopy, probe microscopy, optical microscopy, resistivity mapping, CDE, Creative Design Engineering, ResMap, RS-100, Optical Surface Analysis, Candela, KLA-Tencor, CS1, CS2, CS10, CS20, pits, scratches, LEDs, SiC, GaN, EPI, EPI Scratches, EPI Pits, x-ray, imaging, resolution, 3d, microscope, Auriga Measurement Systems, Pulsed IV, ATE, CTS, Automated Test Systems, Custom Test Systems, ATN Microwave, Agilent, TR Module Testing, TR Modules, Aeroflex, ARXX, Aeroflex Laboratories, MIL-STD-1553, MIL-STD-1397, MIL-STD-1760, ARINC-629, ARINC-429, Electronics, Microelectronics, Flash, Sram, MCM, RISC, CISC, R4430, R4700, Multichip Modules, Hybrid Circuits, Actuator, Phase Noise Measurement Systems, Frequency Synthesizers, esmo, docking hardware, test head docking, test head manipulators, manipulators, inTEST Corporation: ATE manipulators, test head, positioner, ATE hardware, back-end test, six degrees of freedom, in2, in2Pro, ATE docking, docking gusset, cam and cable, Z-stack, wafer probing, probing interface, pogo tower, probe tower, wafer prober, centaur, Transpar, test hardware, Semiconductor test, IC test hardware, ATE, Cascade Microtech, Suss MicroTec, probe stations, probing, micromanipulators, probes, DC probes, RF probes, Summit 12000, Summit 11000, RF-1, Summit 9100, Summit 9101, Alessi, Alessi REL-6100, Alessi REL-4800, R61, R48, REL-4100, REL-3200, Mitutoyo, accel, Accel, Accel-RF, accelrf, ACCELRF, EXCELLRF, AARTS, Reliability Testing Systems, electronics, electrical engineering, microwave, RF, reliability, reliability test services, reliability test products, probe cards, wafer probing, crash resistant, low leakage, semiconductor probing, cascade Microtech, cascade, celadon systems, 300 C testing, reliability, on wafer reliability, -65°C to 300°C operating temperature, Multi-Site, Johnstech, ECT, bantam-pak, pogo pins, high frequency contactors, high performance contactors, interposer, Temptronic, environmental testing equipment, environmental chamber, Industrial ovens, automotive testing, Temptronics, Vibration Shock Test, Environmental Test Chambers, temperature chamber, Climate Test, test fixtures, HAST, Thermal Shock, Fast Temperature Cycle, Thermal Stress Screening, Test Chamber Fixtures, Temperature Characterization, Temperature Testing, thermal test solutions, ESS, Humidity Chambers, sigma systems, sigma, thermal testing, thermal cycling, wafer probing, wafer probe, components, wafers, hybrids, PCBs, wafer prober, temperature testing, temperature chambers, Temperature Testing and Cycling, Thermal Inducing, environmental chambers, Life Testing, Oryx Instruments, ESD Testing, ESD, TLP, HBM, MM, new wave, ndyag, yag, Nd:yag laser systems, pulsed lasers, laser ablation, mass spectrometry, solid sampling, depth profiling, microprobe, fractionation, ICP, ICP-MS,ICP-OES,ICP-AES, isotope ratios, geochronology, laser fluorination, incremental growth bands, LA-ICP-MS, inclusions, zircon, micromill, noble gas mass spectrometry, Isotope ratio mass spectrometry, carbonates, geochemistry, dry aerosol, in-situ, PIV, particle image velocimetry, TR PIV, time resolved piv, high speed piv, particle flow, water flow, air flow, LIBS,FPD,LCD,FPD repair, failure analysis, semiconductor, LED, wafer scribing, scribing, YAG laser, laser machining, laser micromachining, micromachining, micro technology,mems,accuscribe,pegasus,gemini,solo,tempest,polaris,orion,ezlaze,quiklaze, Tamar Technology, optical surface profilers, non-contact optical profilers, Zeta Instruments, Wyko, zygo, white light interferometer, ESI, NDC, NeuDynamics, Hanmi, FASystems, Renesas, Signatone, Johnstech, Condor, copper pillar inspection, sonoscan, wire bonder, wedge bonder, ball bonder, ball bumping, ribbon bonding, pick & place, pull tester, bonder tester, XYZTEC, TPT, TPT Wire Bonder, westbond, west bond, k&s, kulicke & soffa, royce, peak automation, Optical Profiler, 3D Metrology, 3D Image, Stylus Profiler, Non-contact profiler, AFM or atomic force microscopy, (True) Color imaging, Metrology, Roughness (measurement), Waviness (measurement), Step Height (measurement), solar cell (metrology, roughness, waviness, texture), HBLED or LED (manufacturing, roughness), solar wafer, LED wafer, probe station, stations, four point probes, prober, probing, microprobing, microprobe, hot chucks, cold, temperature controllers, probe tips, holders, quadpro, Lucas Labs, Signatone, dc/cv, resistivity test equipment, thermal, characterization, photonics, mems testing, laser cutting, microwave, RF, Picoprobe, vibration isolation tables, environmental chambers, Signatone, microscopes, high frequency RF, IV/CV, gigahertz, failure analysis, low current, femtoamp, device debug, diagnostic lasers, dark boxes, light tight, testhead, bond test, printed circuit board assembly, bond testing, printed circuit board testing, Semiconductor Manufacturers Reps, Molecular imprints, Molecular, Imprints, imprint lithography, lithography, litho, photolithography, UV lithography, UV, UV nanoimprint, nano imprint, nanoimprint, flash lithography, Nano lithography, optical lithography, semiconductor, step and flash, step and repeat, S-FIL, Imprio, advanced lithography, nanolithography, next generation lithography, Nanotechnology, Nano technology, Nano, sub nano, MonoMat, microfluidics, surface treatment, etchers, CVD, ion implant, CLP, back side alignment, radiometers, Power meters, UV measurement, Solar simulator, solar simulation, ozone surface treatment, probes, aligner, bonder, wafer bonder, mask aligner, bond, MEMS, bulk MEMS, semiconductor, photolithography, Fodel¨, thick resist, thin resist, anodic bonding, substrate bonding, micromachining, SOI, biomedical, microfluidics, UV light sources, UV exposure, optoelectronics, wafer bumping, wafer level packaging, alignment, interconnect, darkfield alignment, compound semiconductors, III-V materials, cleanroom automation, conveyors, resistivity meter, metrology tool, laser meter, production aligner, manual aligner, pilot production, engineering tool, Modular Process Technology, RTP, Semiconductor, Rapid Thermal Processing, equipment, tools, manufacturer, 300mm, 200mm, front end process, processing anneal, annealing, annealer, RTA, RTO, MPT, semi-conductor industry, furnace, oven replacement, RTP600, RTP800, RTP3000, Modular One, aoi,AOI,pcb,wafer inspection,automated optical inspection,camtek,Artwork inspection,Assembly,Automatic Final Inspection,Automatic Material Handling,Automatic Optical Inspection,Barco,BGA,PCB,MEP,falcon,CAMT,Camtec,wafer inspection,Camtek,Circuits,Copper,Defect,Design rule check,Diazo,DRC,Inspectify,Inspection,Orion,PCB,Printed Circuit Board,Short circuits,HDI,Microelectronics,High Density Interconnect, defects,falcon, microscope, microscopy, nonoscale optical profilers, optical profilers, advanced confocal microscopy, confocal microscopy, confocal, nanotechnology, hybrid metrology, 3D measurements, 3D imaging, 3d, three dimensional, measurement, imaging, interferometer, interferometry, spectroscopy, light microscopy, probe microscopy, optical microscopy, resistivity mapping, CDE, Creative Design Engineering, ResMap, RS-100, Optical Surface Analysis, Candela, KLA-Tencor, CS1, CS2, CS10, CS20, pits, scratches, LEDs, SiC, GaN, EPI, EPI Scratches, EPI Pits, x-ray, imaging, resolution, 3d, microscope, synchrotron, xradia, tomography, microxct, nanoxfi, nanoxct, fresnel, zone, plates, calibration, targets, optics, semiconductor, bio-medical, fluorescence, Auriga Measurement Systems, Pulsed IV, ATE, CTS, Automated Test Systems, Custom Test Systems, ATN Microwave, Agilent, TR Module Testing, TR Modules, Aeroflex, ARXX, Aeroflex Laboratories, MIL-STD-1553, MIL-STD-1397, MIL-STD-1760, ARINC-629, ARINC-429, Electronics, Microelectronics, Flash, Sram, MCM, RISC, CISC, R4430, R4700, Multichip Modules, Hybrid Circuits, Actuator, Gimbals, Miniature Motors, Space-Qualified, DSP, Limited Angle,Limited Angle Torque Motors, Zero Cog, Zero Cogging Motors, Stepper Motors, Gearhead, Gearheads, Brake, Brakes, Brake Systems, Integral Brake, Positioning Systems, Tachometer, Tachometers, Magnets, Magnetic Motors, 4 Pole, 10 Pole, Resolver, Resolvers, Mini-Motor, Mini-Motors, Multi-Axis Positioning Systems, Rotor, Rotors, Stator, Stators, NASA STD 8739.3, Cryocooler,Telecommunications, Filters, Phase Noise Measurement Systems, Frequency Synthesizers, esmo, docking hardware, test head docking, test head manipulators, manipulators, inTEST Corporation: ATE manipulators, test head, positioner, ATE hardware, back-end test, six degrees of freedom, in2, in2Pro, ATE docking, docking gusset, cam and cable, Z-stack, wafer probing, probing interface, pogo tower, probe tower, wafer prober, centaur, Transpar, test hardware, Semiconductor test, IC test hardware, ATE, Cascade Microtech, Suss MicroTec, probe stations, probing, micromanipulators, probes, DC probes, RF probes, Summit 12000, Summit 11000, RF-1, Summit 9100, Summit 9101, Alessi, Alessi REL-6100, Alessi REL-4800, R61, R48, REL-4100, REL-3200, Mitutoyo, r&d,circuit,board,technology,custom,manufacture,new,jersey,edison,assembly,facility,advanced,high,performance,HDI,state,art,fabrication,varification,design, accel, Accel, Accel-RF, accelrf, ACCELRF, EXCELLRF, AARTS, Realibility Testing Systems, electronics, electrical engineering, microwave, RF, reliability, reliability test services, reliability test products, probe cards, wafer probing, crash resistant, low leakage, semiconductor probing, cascade, celadon systems, 300 C testing, reliability, on wafer reliability, -65°C to 300°C operating temperature, Multi-Site, Johnstech, ECT, bantam-pak, pogo pins, high frequency contactors, high performance contactors, interposer, Temptronic, environmental testing equipment, environmental chamber, Industrial ovens, automotive testing, Temptronics, Vibration Shock Test, Environmental Test Chambers, temperature chamber, Climate Test, test fixtures, HAST, Thermal Shock, Fast Temperature Cycle, Thermal Stress Screening, Test Chamber Fixtures, Temperature Characterization, Temperature Testing, thermal test solutions, ESS, Humidity Chambers, thermal testing, thermal cycling, wafer probing, wafer probe,components, wafers, hybrids, PCBs, wafer prober, temperature testing, temperature chambers, Temperature Testing and Cycling, Thermal Inducing, environmental chambers, Life Testing, Oryx Instruments, ESD Testing, ESD, TLP, HBM, MM, new wave,ndyag,yag,Nd:yag laser systems,pulsed lasers,laser ablation,mass spectrometry,solid sampling,depth profiling,microprobe,fractionation,ICP, ICP-MS,ICP-OES,ICP-AES,isotope ratios,geochronology,laser fluorination,incremental growth bands,LA-ICP-MS,inclusions,zircon,micromill,noble gas mass spectrometry,Isotope ratio mass spectrometry,carbonates,geochemistry,dry aerosol,in-situ,PIV, particle image velocimetry,TR PIV,time resolved piv,high speed piv,particle flow,water flow,air flow,LIBS,FPD,LCD,FPD repair,failure analysis,semiconductor,LED,wafer scribing,scribing,YAG laser,laser machining,laser micromachining,micromachining,micro technology,mems,up193he,up213,up266,up266macro,mir10,micromill,accuscribe,pegasus,gemini,solo,tempest,polaris,orion,ezlaze,quiklaze, Tamar Technology, optical surface profilers, non-contact optical profilers, bondtesting, bondtester, wirepull, sheartest, wire bond, wire bonding, wafer test, wafer testing, shear testing, shear test, wire pull, ball shear, cavity shear, cold bump pull, die shear, ribbon peel, stud pull, ribbon pull, tweezer pull, usb tweezers, vector pull, wedge shear, hot bump pull, condor sigma, condor sigma w12, condor EZ, condor 70, condor 100, condor 150, condor 150HF, condor 250, dage 4000, bt14, bt22, bt23, bt24, bt2400, bt26, bt28, bt3000, bt4000, bt4000+, bt5000, dage optima, dage 3000, dage 3800, 4000plus, 4000+, dage 4000+, dage 4000plus, dage 4300, dage 5000, royce 226, royce 550, royce 552, royce 580, royce 620, royce 650, JetEtch, Jet Etch, JetEtch Decapsulation, Jet Etch Decapsulation, JetEtch Decap, Jet Etch Decap, Decapsulation, Decap, IC Decap, Acid Decap, Plastic Decapsulation, Plastic Decap, Nitric, Sulfuric, Acid, Nitric Acid, Sulfuric Acid, Plastic, Counterfeit Protection, Etch, Etching, Nitric Etch, Nitric Etching, Sulfuric Etch, Sulfuric Etching, Plastic Etching, Laser Decapsulation, Laser Decap, Laser Etching, Laser Etch, Nisene, Nisene Technology Group, Nisene Technology Group Inc. B&G, B & G, B&G International, B & G International, BG, BG International, leto, Pegasus evolution, orion, Neptune evolution, final test cart, ares, engineering carts, trolleys, cam dock, p-cam dock, pib-lock, hinge-dock, verigy docking, probe card stiffener, clamp shell, ATS-505, ATS-605, ATS-515, ATS-615, ATS-525, ATS-625, ATS-535, ATS-635, ATS, 545, ATS-645, ATS-710, ATS-810, ATS-730, ATS-830, ATS-750, ATS-850, ATS-770, ATS-870, LJ-V series, LJ-G series, High-accuracy 2D Laser Displacement Sensor, Ultra-High Speed In-line Profilometer, KEYENCE, soldering systems, lead-free, vacuum soldering, smart card production, soldering, lead-free soldering, void-free soldering, void free, chip production, preform soldering systems, preform, paste, paste soldering systems, SST International,global leader,equipment,microelectronics assembly,heat,vacuum,gas pressures,void-free,vacuum soldering,brazing,glass sealing,wafer bonding,partner,innovative,high-reliability,electronic manufacturing,package, flux less soldering, vacuum reflow soldering, vacuum soldering, vacuum reflow, vacuum reflow oven, void free soldering, thick film firing oven, LTCC sintering oven, solid source diffusion furnace, polyimide curing oven
cwitechsales.com Whois Information:
  • 1.
    Domain Name:
    cwitechsales.com
  • 2.
    Domain Age:
    17 years old
  • 3.
    Name Server 1:
    ns09.domaincontrol.com
  • 4.
    Name Server 2:
    ns10.domaincontrol.com
  • 5.
    Created:
    Thursday 01. July 1999
  • 6.
    Expires:
    Saturday 01. July 2017
  • 7.
    Domain Registrar:
    godaddy.com, LLC
Website Important Html Tags:
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    TEXT
  • strong
    Knowledge. Solutions. Support.
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    Knowledge. Solutions. Support.
  • strong
    Knowledge. Solutions. Support.
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    Knowledge. Solutions. Support.
  • strong
    Knowledge. Solutions. Support.
  • strong
    Leading
  • strong
    Knowledge. Solutions. Support.
cwitechsales.com IP Information:
  • 1.
    Ip Address:
    173.201.239.128
  • 2.
    Country:
    United States
  • 3.
    Status Code:
    OK
  • 4.
    Region Name:
    Arizona
  • 5.
    City Name:
    Scottsdale
  • 6.
    Zip Code:
    85260
  • 7.
    Speed test:
    19.2 ms
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